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GRINDING WHEEL, GRINDING SYSTEM WITH THE SAME GRINDING WHEEL, AND GRINDING METHOD USING THE SAME GRINDING SYSTEM

机译:磨轮,具有相同磨轮的磨削系统以及使用该磨削系统的磨削方法

摘要

PROBLEM TO BE SOLVED: To provide a grinding wheel, a grinding system with the same grinding wheel, and a grinding method employing the same grinding system capable of coping with both suitable surface roughness and a plane surface having non-undulation by improving an organization of the grinding wheel.;SOLUTION: In the grinding wheel 10 having abrasives 12, first bond, and second bond, the abrasive 12 is coated with the first bond, the abrasives 12 are dispersed into the second bond, and compression ratio of the second bond is lessened rather than that of the first bond. Further, the first bond is resinoid bond 14, and the second bond is preferably vitrified bond 16.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种砂轮,具有相同砂轮的磨削系统以及采用该砂轮磨削方法的磨削方法,该磨削方法能够通过改善砂轮的组织来应对合适的表面粗糙度和具有不起伏的平面。解决方案:在具有研磨剂12,第一结合剂和第二结合剂的研磨轮10中,研磨剂12涂有第一结合剂,研磨剂12分散到第二结合剂中,第二结合剂的压缩比减少而不是第一个债券。此外,第一键是类树脂键14,第二键优选是玻璃化键16。版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP2008049447A

    专利类型

  • 公开/公告日2008-03-06

    原文格式PDF

  • 申请/专利权人 COVALENT MATERIALS CORP;

    申请/专利号JP20060229031

  • 发明设计人 KINAI FUMIAKI;

    申请日2006-08-25

  • 分类号B24D3/34;B24D3/00;B24D3/28;B24D3/14;B24B7/17;

  • 国家 JP

  • 入库时间 2022-08-21 20:20:45

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