BURN-IN SOCKET FOR BGAIC DEVICES HAVING INTEGRATED SLIDER OF FULL COMPATIBILITY WITH BALL GRID

摘要

PROBLEM TO BE SOLVED: To enhance the ball grasping force of a slider of a BGA type IC socket.;SOLUTION: A slider 24 has a top wall surface 14b on which a plurality of openings of a grid array defined by intersecting ribs are formed. Anti-stick fingers 24c extend in the x-direction from a wall extension portion 24b along a y-direction rib defining the outer limit of the first column of the openings of a main grid. A concave surface is formed on each finger and faces the wall extension portion 24b. The height of the wall extension portion 24b is kept lower than the position of solder balls of an IC device mounted in the socket to provide clearance for balls for mechanical support positioned in the first column of the openings next to the wall extension portion 24b outside a main grid field, and sufficient grid array capability is provided.;COPYRIGHT: (C)2008,JPO&INPIT