MANUFACTURING PROCESS FOR ELECTROCONDUCTIVE LAYER-BONDED MATERIAL AND MANUFACTURING PROCESS FOR PART USING THIS ELECTROCONDUCTIVE LAYER-BONDED MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing process for an electroconductive layer-bonded material in which an electroconductive plate with an excellent conductivity and a non-alloy electroconductive layer or a non-alloy electroconductive layer and an electroconductive layer and a polymer plate being the base material are bonded in more than one layers and a manufacturing process for part using the electroconductive layer-bonded material applicable for display use and the like.;SOLUTION: The electroconductive layer-bonded material 22 or 23 is obtained by bonding the polymer plate 24, the non-alloy electroconductive layer 25 and the electroconductive plate 26 or the polymer plate 24, the non-alloy electroconductive layer 25, the electroconductive layer 27 and the electroconductive plate 26 in more than one layers. At least one bonded interface in the electroconductive layer-bonded material 22 or 23 is obtained in a way that the surfaces to be bonded are activation-treated and the activation-treated surface are brought into contact face to face and bonded. Parts applicable for use in displays and the like are manufactured using the electroconductive layer-bonded material 22 or 23.;COPYRIGHT: (C)2008,JPO&INPIT