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The load detection device and the load method of detection null electronic parts of the bonding

机译:载荷检测装置及载荷检测方法,用于检测接合的空电子部分

摘要

PROBLEM TO BE SOLVED: To provide a device and a method for detecting a load of a crimping contact head for electronic parts capable of improving the accuracy of controlling of the load in the crimping.;SOLUTION: In a crimping contact device of an electronic part for bonding an electronic part to a substrate 3 by the crimping contact head 17 by virtue of the pressure, a load cell 15 and a spring 16 having a linear load-displacement characteristic as a load detecting means for detecting the load applied to the crimping contact head 17 are interposed between a lifting section 7 for movably supporting the crimping contact head 15 in the vertical direction and the crimping contact head 17, are used in a series combination. As a result, a displacement among of the load detecting means is increased and the variation amount of the pressure load by each lifting/lowering operation is reduced so that the resolution of the pressure load can be improved, and then the accuracy in controlling of the pressure load can be improved.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种用于检测电子部件的压接接触头的负载的装置和方法,该设备和方法能够提高压接中的负载控制的精度。解决方案:在电子部件的压接接触装置中用于通过压接头17通过压力将电子部件粘接到基板3上的,具有线性负载-位移特性的测力传感器15和弹簧16作为用于检测施加到压接头的负载的负载检测装置。压接头17插入在用于沿竖直方向可移动地支撑压接头15的提升部7和压接头17之间,以串联方式使用。结果,增加了负载检测装置之间的位移,并且减小了由每个升降操作引起的压力负载的变化量,从而可以提高压力负载的分辨率,然后控制压力的精度。压力负荷可以得到改善。;版权所有:(C)2003,日本特许厅

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