首页> 外国专利> The polymer for the built-in type capacitor/the ceramic compound paste and production method of the capacitor which utilizes this {Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using the same}

The polymer for the built-in type capacitor/the ceramic compound paste and production method of the capacitor which utilizes this {Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using the same}

机译:{用于嵌入式电容器的聚合物/陶瓷复合糊剂以及使用该聚合物/陶瓷复合糊剂制造电容器的方法}

摘要

A polymer/ceramic composite paste for an embedded capacitor includes an organic solvent, a ceramic powder having a particle diameter of not more than 20 mum dispersed in the organic solvent, a polymer and a hardener. The use of the polymer/ceramic composite paste enables the formation of a dielectric layer having a high dielectric constant. The polymer/ceramic composite paste can be applied by a screen printing technique and is planarized to locally form a polymer/ceramic composite dielectric layer having a thickness of, e.g., up to 20 mum on a desired region. Accordingly, electrical parasitics resulting from the formation of a capacitor on unwanted regions can be reduced, and the capacitance error can be reduced.
机译:用于嵌入式电容器的聚合物/陶瓷复合浆料包括有机溶剂,分散在有机溶剂中的粒径不大于20μm的陶瓷粉末,聚合物和硬化剂。聚合物/陶瓷复合糊剂的使用使得能够形成具有高介电常数的介电层。可以通过丝网印刷技术施加聚合物/陶瓷复合糊剂,并且将其平面化以在所需区域上局部形成厚度例如为至多20μm的聚合物/陶瓷复合介电层。因此,可以减少由于在不需要的区域上形成电容器而导致的电寄生现象,并且可以减小电容误差。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号