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Holding down the ceramic green tip/chip prime field which cuts off

机译:按住截止的陶瓷绿色尖端/切屑素场

摘要

PROBLEM TO BE SOLVED: To surely separate a block of ceramic green chip element into component units, by applying a simple means for pressing the block of ceramic green chip element to separate into component units, using a pressure-welding roller arranged in the vicinity of the terminal turning to the lower part of a belt conveyor.;SOLUTION: A block B of ceramic green chip element is preheated to about from 90 to 100°C by using a heating furnace 3, the temperature of resin binder is kept at a glass transition temperature of about 60°C, until the block is conveyed to the vicinity of the terminal turning to the lower part of a belt conveyor 1; the block B of ceramic green chip element is pressed by a pressure-welding roller 2 in the vicinity of the terminal turning to the lower part of the belt conveyor 1 and separated into discrete component units, and further, the discrete ceramic green chip elements are cooled to about 40°C, by applying air pressure using an air discharge apparatus 4 from the carrying out side of the belt conveyor 1 for ceramic green chip elements.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:通过使用一种简单的方法,通过使用设置在陶瓷生芯片元件块附近的压力焊接辊,将陶瓷生芯片元件块压制成组件单元,以确保将陶瓷生芯片元件块拆分成组件单元。解决方案:使用加热炉3将陶瓷生坯芯片块B预热到90至100℃,树脂粘合剂的温度保持在玻璃上转变温度约为60℃,直到块被输送到转向带式输送机1下部的终端附近为止;陶瓷生坯元件块B在转弯至带式输送机1下部的终端附近被压焊辊2挤压,并分离为离散的组件单元,此外,离散的陶瓷生坯元件为通过使用空气排放装置4从带式输送机1的生坯陶瓷带式输送机1的出风侧施加空气压力将其冷却至约40℃。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4069324B2

    专利类型

  • 公开/公告日2008-04-02

    原文格式PDF

  • 申请/专利权人 TDK株式会社;

    申请/专利号JP20050035278

  • 发明设计人 伊藤 誠;高橋 和治;

    申请日2005-02-10

  • 分类号H01G4/12;H01G4/30;H01G13/00;

  • 国家 JP

  • 入库时间 2022-08-21 20:17:48

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