首页> 外国专利> Ceramic foil chip capacitor mfr. - where stacks of metallised foils sepd. by ceramic slip are cut into small stacks, baked, and then sepd. into chips

Ceramic foil chip capacitor mfr. - where stacks of metallised foils sepd. by ceramic slip are cut into small stacks, baked, and then sepd. into chips

机译:陶瓷箔片电容器mfr。 -堆积成堆的金属箔的地方。用陶瓷粉将它们切成小叠,烘烤,然后隔垫。筹码

摘要

Metallised, crude ceramic foils are assembled together to make blocks (a). A vertical stack is then made from several blocks, which are each sepd. from the adjacent blocks by a ceramic slip. The stack is then cut into numerous small stacks (b) by a milling machine; and the small stacks (b) are baked to sinter the ceramic before stacks (b) are sepd. into separate, small blocks (c). The ceramic slip is pref. applied by spraying, and consists of a mixt. of a solvent, a binder, and an inert filler. The binder is pref. an hydroxy-ethyl-cellulose, esp. a methyl-hydroxyethyl-cellulose. The pref. milling machine uses three disk milling cutters so three cuts can be made simultaneously in a block. Rapid mass prodn. is achieved.
机译:将金属化的粗陶瓷箔组装在一起以制成块(a)。然后由几个块组成一个垂直堆栈,每个块都分开。从相邻的块通过陶瓷滑移。然后用铣床将纸堆切成许多小的纸堆(b)。然后将小叠层(b)烘烤以烧结陶瓷,然后再分离叠层(b)。分成单独的小块(c)。陶瓷片是首选。通过喷涂施工,并由混合料组成。溶剂,粘合剂和惰性填料组成。粘合剂是优选的。羟乙基纤维素,特别是甲基羟乙基纤维素。偏好。铣床使用三个圆盘铣刀,因此可以在一个块中同时进行三个切割。快速批量生产已完成。

著录项

  • 公开/公告号FR2523760A1

    专利类型

  • 公开/公告日1983-09-23

    原文格式PDF

  • 申请/专利权人 LCC CICE CIE EUROP COMPOSANTS EL;

    申请/专利号FR19820004746

  • 发明设计人 FRANCOIS OUDARD;

    申请日1982-03-19

  • 分类号H01G4/12;

  • 国家 FR

  • 入库时间 2022-08-22 09:59:36

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