STACKING STRUCTURE FOR MULTI-LAYER CERAMIC ELECTRONICS AND A FABRICATING METHOD FOR MULTI-LAYER CERAMIC ELECTRONICS USING THE SAME TO PREVENT ADHESION OF CERAMIC CHIPS DURING CUTTING AND STACKING

摘要

PURPOSE: A stacking structure for multi-layer ceramic electronics and a fabricating method for multi-layer ceramic electronics using the same are provided to prevent adhesion of ceramic chips being cut and stacked by arranging the ceramic chips on a curved platform.;CONSTITUTION: Chips(10) cut by blades are stacked on a stacking structure(30) which comprises a platform(300) and a shaft. The platform is formed of a magnetic material in a circular or semi-circular shape. The interval between the chips is greater than that between the blades. The shaft is formed under the platform to support the platform.;COPYRIGHT KIPO 2012