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Containment electroless deposition treatment manner and the electroless deposition
Containment electroless deposition treatment manner and the electroless deposition
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机译:密闭化学沉积处理方式及化学沉积
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摘要
After the processing element, was fed an additive containing a reducing agent, and provides a solution containing metal ions such as copper sulfate solution to the processing element. In order to separate the solution containing metal ions and additives, the adjustment of the composition of the plating solution can be easily.
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