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Flexible wiring board, semiconductor chip mounting flexible wiring board, display device, semiconductor chip mounting method

机译:挠性电路板,半导体芯片的安装挠性电路板,显示装置,半导体芯片的安装方法

摘要

A flexible circuit board is provided to prevent unsuccessful interconnection between the wirings of the flexible circuit board and the output terminals of a semiconductor chip, the flexible circuit board having a plurality of sections of wirings of different sizes, each section including a pattern of wirings of the same size. The flexible circuit board has predetermined patterns of wirings on an insulating material base, and the wirings are electrically connected to the output terminals of a semiconductor chip. A pattern of the wirings of the same size forms a first wiring section, while another pattern of the wirings of the same size form a second wiring section. The flexible circuit board is provided with a pattern transition region between the neighboring wiring sections with wirings of different sizes to avoid unsuccessful interconnection which would be otherwise caused by the difference in size between the wirings.
机译:提供了一种柔性电路板,以防止在柔性电路板的布线与半导体芯片的输出端子之间的不成功互连,该柔性电路板具有多个尺寸不同的布线部分,每个部分包括布线图案。一样的大小。柔性电路板在绝缘材料基体上具有预定图案的布线,并且这些布线电连接至半导体芯片的输出端子。相同尺寸的布线的图案形成第一布线部分,而相同尺寸的布线的另一图案形成第二布线部分。柔性电路板在具有不同尺寸的布线的相邻布线部分之间设置有图案过渡区域,以避免互连不成功,否则互连不成功是由布线之间的尺寸差异引起的。

著录项

  • 公开/公告号JP4083638B2

    专利类型

  • 公开/公告日2008-04-30

    原文格式PDF

  • 申请/专利权人 東北パイオニア株式会社;

    申请/专利号JP20030203478

  • 发明设计人 松田 厚志;大峡 秀隆;

    申请日2003-07-30

  • 分类号H01L21/60;H05K1/02;H05K1/11;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 20:17:24

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