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Low-power infrared scene projector array

机译:低功率红外场景投影仪阵列

摘要

(57) Abstract The manner which produces array and its array which project the thermal imagery. Array of this invention has been brought together two-layer architecture and the tupple which are produced by uniqueness treatment, as a result, each pixel component (12) in order on the single stage high platform, to cover the individual electronic both element control circuit (14) directly, is located, conductive trace, in order that the thermal imagery is projected at speed above video frame speed, in order to be able to control the multiple pixels, joins those pixels. The micro glass lens assembly which is joined to the individual pixel improves the thermal efficiency of array concerning several applications. Regarding this production manner, it is located to the lower part of the pixel which the electronic pixel circuit is related and at the same time as for the electronic array circuit there is the same tip/chip, as array in order for the fill factor and time constant of array after the completing to be improved with that, it can obtain the semiconductor microphone lob ridge die structure which uses sacrifice formation for the lower part of the evaporation pixel component as compact array.
机译:(57)<摘要>产生阵列的方式及其投射热像的阵列。本发明的阵列已经汇集了两层结构和通过唯一性处理产生的二合一,结果,在单级高平台上依次排列了每个像素组件(12),以覆盖各个电子两元控制电路(14)直接定位导电迹线,以使热像以高于视频帧速度的速度投影,以便能够控制多个像素,并加入那些像素。连接到单个像素的微玻璃透镜组件提高了涉及多种应用的阵列的热效率。关于这种生产方式,其位于与电子像素电路相关的像素的下部,并且与电子阵列电路同时具有与阵列相同的尖端/芯片,以用于填充系数和由此,通过完成阵列的时间常数的改善,可以获得以蒸发像素成分的下部的牺牲形成为紧凑阵列的半导体传声器凸脊芯片结构。

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