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With the system conservation the integrated circuit wafer during conservation system null retaining and shipment of the integrated circuit (IC)

机译:通过系统保护,在保护系统期间集成电路晶片将空置并运送集成电路(IC)

摘要

(57) Abstract Container 11 of integrated circuit wafer 19 offers mechanical impact and the protection from electric charge to the wafer. The wafer is protected mechanically by apex and bottom cushion 21, 23 and side section cushion 25. Apex and the bottom cushion respectively have foaming body 27 inside the enclosure of the membrane or film 29. The enclosure, in order to be able to enter and leave vapor 33, has opening 31. The side section cushion has the elastic projection 41 which protects the edge of the wafer. The side section cushion, is put between flange 38 of the apex cushion and the bottom cushion. The individual wafer is separated from mutual by the thin layer separator 20 which was drawn up with the film. Separator 20 and apex and bottom cushion film 29 of 21 and 23 may be the same type. The film has the 2nd layer 53 which was drawn up with the polymer which does not have the 1st layer 51 which was drawn up with the polymer which includes the dissipation material, or the dissipation material. 1st layer and 2nd layer is connected mutually. Insulating layer, is arranged when it is contacted on circuit side of the wafer. The dissipation material may be carbon. The container has ground stud 73 in the wall. The ground stud contacts with the film inside the container, it is possible to ground outside the container.
机译:(57)<摘要>集成电路晶片19的容器11提供机械冲击并保护免受晶片的电荷。晶片由顶部和底部衬垫21、23以及侧部衬垫25机械地保护。顶点和底部衬垫分别在膜或膜29的外壳内部具有发泡体27。该外壳能够进入并进入薄膜或薄膜。残留蒸气33,具有开口31。侧部缓冲垫具有保护晶片边缘的弹性突起41。侧部垫被置于顶部垫的凸缘38和底部垫之间。各个晶片通过被薄膜拉起的薄层分离器20相互分离。隔板20以及21和23的顶部和底部缓冲膜29可以是相同类型。膜具有第2层53,该第2层53由不具有由包含耗散材料或耗散材料的聚合物形成的第一层51的聚合物覆盖。第一层和第二层相互连接。绝缘层在其与晶片的电路侧接触时被布置。耗散材料可以是碳。容器的壁上有接地的螺栓73。接地螺栓与容器内部的薄膜接触,可以在容器外部接地。

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