Circuit board, method of connecting terminals to circuit board, and method of manufacturing battery pack

摘要

PPROBLEM TO BE SOLVED: To reduce conduction resistance by securing a sufficiently large application area of solder paste to increase connection strength. PSOLUTION: In an application process wherein solder is applied in a prescribed pattern on a joint part of a circuit board to form a solder application section 30, the solder application section consists of a plurality of solder application areas 31a, 31b, 31c, and 31d wherein solder is applied in a wide width, and connection areas 32a, 32b, 32c, and 32d wherein solder is applied in a narrower width than in the solder application areas. The plurality of solder application areas are connected by the connection areas. PCOPYRIGHT: (C)2004,JPO&NCIPI