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One-dimensional semiconductor substrate, as well as, and device using the one-dimensional semiconductor substrate, array element, module

机译:一维半导体衬底以及使用该一维半导体衬底的装置,阵列元件,模块

摘要

A method of manufacturing a one-dimensional semiconductor substrate as a semiconductor circuit board, and I to provide a method for manufacturing the same device using the one-dimensional semiconductor substrate, element array, module, display, and solar cell modules and solar cells. 2 or one-dimensional semiconductor substrate 1 of the present invention comprises one or more layers form a thin film 4 of the desired substrate 3 linear with a length of 10 times or more relative to the diameter or width or thickness have. One-dimensional semiconductor thin film is formed by applying a thin film semiconductor to 4. 2 or one-dimensional semiconductor substrate 1 of the present invention is produced by applying a linear surgery is a manufacturing technique of the optical fiber.
机译:一种制造一维半导体衬底作为半导体电路板的方法,以及本发明提供一种用于使用一维半导体衬底,元件阵列,模块,显示器以及太阳能电池模块和太阳能电池制造同一器件的方法。如图2或图1所示,本发明的一维半导体衬底1包括一层或多层形成所需衬底3的薄膜4,其线性相对于直径或宽度或厚度具有10倍或更多倍的长度。通过将薄膜半导体应用于4来形成一维半导体薄膜。本发明的2或一维半导体衬底1是通过进行线性手术而制造的,这是光纤的制造技术。

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