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Methods for Forming Process Test Capacitors for Testing Embedded Passives During Embedment into a Printed Wiring Board
Methods for Forming Process Test Capacitors for Testing Embedded Passives During Embedment into a Printed Wiring Board
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机译:形成过程测试电容器的方法,用于在嵌入印刷线路板期间测试嵌入式无源器件
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摘要
Making process test capacitors simultaneously with circuit capacitors that are to be embedded into a printed wiring board and firing the test capacitors to result in fired-on-foil test capacitors for the purpose of using the test capacitors as test substitutes for the embedded circuit capacitors to predict whether capacitance, dissipation factor or insulation resistance of the circuit capacitors will fall within acceptable specified ranges prior to and after embedment.
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