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Methods for forming process test capacitors for testing embedded passives during embedment into a printed wiring board

机译:形成过程测试电容器的方法,用于在嵌入印刷电路板期间测试嵌入式无源元件

摘要

Making process test capacitors simultaneously with circuit capacitors that are to be embedded into a printed wiring board and firing the test capacitors to result in fired-on-foil test capacitors for the purpose of using the test capacitors as test substitutes for the embedded circuit capacitors to predict whether capacitance, dissipation factor or insulation resistance of the circuit capacitors will fall within acceptable specified ranges prior to and after embedment.
机译:同时制造过程测试电容器和要嵌入印刷电路板的电路电容器,并烧制测试电容器以产生箔上烧成的测试电容器,目的是使用测试电容器作为嵌入式电容器的测试替代品预测在嵌入前后电路电容器的电容,耗散因数或绝缘电阻是否会落在可接受的指定范围内。

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