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Method of manufacturing a vertically-structured GaN-based light emitting diode

机译:垂直结构的GaN基发光二极管的制造方法

摘要

The present invention relates to a method of manufacturing a vertically-structured GaN-based light emitting diode. The method of manufacturing a vertically-structured GaN-based light emitting diode includes forming a GaN layer on a substrate; patterning the compound layer in a predetermined shape; forming an n-type GaN layer on the patterned compound layer through the epitaxial lateral over-growth process and sequentially forming an active layer and a p-type GaN layer on the n-type GaN layer; forming a structure supporting layer on the p-type GaN layer; sequentially removing the substrate and the GaN layer formed on the substrate after forming the structure supporting layer; removing the patterned compound layer exposed after removing the GaN layer so as to form an n-type GaN layer patterned in a concave shape; and forming an n-type electrode on the n-type GaN layer patterned in a concave shape.
机译:垂直结构的GaN基发光二极管的制造方法技术领域本发明涉及一种垂直结构的GaN基发光二极管的制造方法。制造垂直结构的GaN基发光二极管的方法包括在衬底上形成GaN层;以及在衬底上形成GaN层。将化合物层图案化为预定形状;通过外延横向过生长工艺在图案化的化合物层上形成n型GaN层,并在n型GaN层上依次形成有源层和p型GaN层。在p型GaN层上形成结构支撑层;在形成结构支撑层之后,顺序地去除衬底和在衬底上形成的GaN层;去除去除GaN层后暴露出的图案化化合物层,以形成凹形图案化的n型GaN层;在形成为凹状的n型GaN层上形成n型电极。

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