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Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor
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机译:薄膜电容器,内置有薄膜电容器的印刷电路板及其制造方法
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摘要
There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.
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