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System and method for determining reticle defect printability

机译:确定掩模版缺陷可印刷性的系统和方法

摘要

A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.
机译:一种用于确定在加工期间掩模版或光掩模上的缺陷在基板上的可印刷性的方法和软件程序。这是通过创建具有多个显示缺陷的单个像素图像的像素网格图像来执行的。将灰度值分配给像素网格图像的每个像素图像,并选择缺陷的可能的中心像素。然后确定缺陷的极性,并使用可能的中心缺陷和缺陷的极性来选择缺陷的粗略中心像素。如果选择了粗糙的中心像素,则可以可选地从粗糙的中心像素和缺陷的极性中选择缺陷的精细中心。从中心像素可以确定缺陷的物理范围,然后确定缺陷的物理范围的透射能级。可选地,可以使用缺陷的物理范围和极性来确定缺陷与掩模版或光掩模上的图案边缘的接近度。然后,可以从缺陷的透射能级和用于从掩模版或光掩模生产衬底的晶片制造工艺的特性来确定缺陷的可印刷性。

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