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Method and apparatus for a low thermal impedance printed circuit board assembly
Method and apparatus for a low thermal impedance printed circuit board assembly
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机译:低热阻印刷电路板组件的方法和设备
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摘要
A low thermal impedance printed circuit board assembly compatible with surface mount assembly reflow solder processes is presented. The low thermal impedance printed circuit board assembly may have filled vias soldered directly to solder balls of the surface mount assembly.
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