首页>
外国专利>
Thin embedded active IC circuit integration techniques for flexible and rigid circuits
Thin embedded active IC circuit integration techniques for flexible and rigid circuits
展开▼
机译:用于柔性和刚性电路的薄型嵌入式有源IC电路集成技术
展开▼
页面导航
摘要
著录项
相似文献
摘要
A flexible electronic circuit member formed of a plurality of dielectric layers includes a plurality of thinned semiconductor chips embedded within the circuit member for increased levels of integration and component density. The thinned semiconductor chips may include various integrated circuits thereon. They may be formed on various substrates and using various technologies and the embedded, thinned semiconductor chips are interconnected by a patterned interconnect that extends between and through the respective dielectric layers. A method for forming the flexible circuit member includes joining semiconductor chips to a mounting apparatus using a releasable bonding layer then forming thinned semiconductor chips that are joined to respective dielectric layers that combine to form the flexible electronic circuit member. The releasable bonding layer is removed after the thinned semiconductor chips are joined to the respective dielectric layers used in combination to form the electronic circuit member.
展开▼