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Compound semiconductor multilayer structure, hall device, and hall device manufacturing method

机译:化合物半导体多层结构,霍尔器件及霍尔器件的制造方法

摘要

Hall device is provided by enabling stable provision of a quantum well compound semiconductor stacked structure. It has first and second compound semiconductor layers composed of Sb and at least two of five elements of Al, Ga, In, As and P, and an active layer composed of InxGa1-xAsySb1-y (0.8≦x≦1.0, 0.8≦y≦1.0), which are stacked. Compared with the active layer, the first and second compound semiconductor layers each have a wider band gap, and a resistance value five times or more greater. The lattice constant differences between the active layer and the first and second compound semiconductor layers are each designed in a range of 0.0-1.2%, and the thickness of the active layer is designed in a range of 30-100 nm.
机译:通过使得能够稳定地提供量子阱化合物半导体堆叠结构来提供霍尔器件。它具有由Sb和Al,Ga,In,As和P的五个元素中的至少两个组成的第一和第二化合物半导体层,以及由In x Ga 1-组成的有源层将x As y Sb 1-y (0.8≦x≦1.0,0.8≦y≦1.0)层叠。与活性层相比,第一化合物半导体层和第二化合物半导体层各自具有较宽的带隙,并且电阻值大于或等于五倍。有源层与第一化合物半导体层和第二化合物半导体层之间的晶格常数差分别设计在0.0-1.2%的范围内,并且有源层的厚度设计在30-100nm的范围内。

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