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Device for avoiding timing violations resulting from process defects in a backfilled metal layer of an integrated circuit
Device for avoiding timing violations resulting from process defects in a backfilled metal layer of an integrated circuit
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机译:用于避免由于集成电路的回填金属层中的工艺缺陷而导致的时序违规的装置
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摘要
A method and firmware for avoiding timing violations resulting from process defects in a backfilled metal layer of an integrated circuit includes steps of receiving as input timing information for an integrated circuit design including at least one metal layer and a plurality of signal wires and dummy metal wires in the metal layer, finding at least one of a setup time and a hold time for each signal wire in the metal layer from the timing information, identifying a timing-critical signal wire from at least one of the setup time and the hold time for one of the signal wires that would produce a timing violation in the signal wire when the signal wire is shorted to a dummy metal wire by a process defect in the metal layer, calculating at least one of a wire width, a fracture interval, and a spacing for modifying the dummy metal wire to avoid the timing violation in the timing-critical signal wire, and generating as output at least one of the wire width and the fracture interval for the dummy metal wire.
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