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Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor
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机译:晶片级处理的工艺,以减少粘滞并使钝化的微加工表面及其所用化合物
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摘要
This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
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