Methods for the use and manufacture of infrared position sensing detector focal plane arrays for optical tracking

摘要

A Sensor Chip Assembly (SCA) contains a focal plane array constructed as a semiconductor chip sandwich. One slice contains an array of PSDs made from IR sensitive semiconductor material, and the other slice contains Trans Impedance Amplifiers (TIAs)—and associated on-chip signal processing elements from an electronic semiconductor material. The SCA resembles those made for pixelized imaging IR SCA focal planes, but the configuration and implementation of which is for a PSD focal plane array. The use of these techniques assures that the PSD focal plane array possesses the required attributes. Interconnect technology is widely available from most IR fabrication houses to connect the IR array with the TIA circuits.