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Interface module for connecting LSI packages, and LSI-incorporating apparatus

机译:用于连接LSI封装的接口模块和LSI集成装置

摘要

An interface module for connecting LSI packages includes a connecting member which is to be mounted on an LSI package including an LSI chip and which includes lines to be electrically connected to the LSI package, an optoelectronic transducer which is mounted on the connecting member, which is connected to the lines of the connecting member, and which converts optical signal to electric signal or converts electric signal to optical signal, an optical waveguide which includes an optical input end and an optical output end, one of which is optically connected to the optoelectronic transducer, and a reinforcing film which is adhered to the optical waveguide, covering at least one side of the optical waveguide, and which is secured at one end to the connecting member.
机译:用于连接LSI封装的接口模块包括:连接构件,其被安装在包括LSI芯片的LSI封装上,并且包括被电连接至LSI封装的线;光电换能器,其被安装在该连接构件上,该光电变换器被安装在连接构件上。连接到连接构件的线并且将光信号转换为电信号或将电信号转换为光信号的光波导,其包括光输入端和光输出端,其中一个光连接到光电换能器以及增强膜,该增强膜粘附到光波导,覆盖光波导的至少一侧,并且在一端固定到连接构件。

著录项

  • 公开/公告号US7312520B2

    专利类型

  • 公开/公告日2007-12-25

    原文格式PDF

  • 申请/专利权人 HIDETO FURUYAMA;HIROSHI HAMASAKI;

    申请/专利号US20050233175

  • 发明设计人 HIROSHI HAMASAKI;HIDETO FURUYAMA;

    申请日2005-09-23

  • 分类号H01L23/48;H01L29/22;H01L31/0232;

  • 国家 US

  • 入库时间 2022-08-21 20:09:27

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