PROCESS AND DEVICE FOR ALIGNING THE SUBSTRATE AND A PRINTING STENCIL IN SOLDER PASTE PRINTING

摘要

The invention relates to a process and a device for aligning a substrate and a printing stencil to one another in the printing of the substrate with solder paste, said process comprising the following steps: Bringing the first substrate into a position opposite to and at a distance from the printing stencil, introducing a first optical sensing device between the printing side of the first substrate and the printing stencil, sensing the position-determining first structures of the first substrate and of the printing stencil by means of the first optical sensing device, aligning the first substrate and the printing stencil with one another on the basis of information gained from the structure sensing, by means of a second optical sensing device acquiring reference data of position-determining second structures on the side of the first, aligned substrate facing away from the printing side, removing the first optical sensing device, removing the first substrate and bringing a second substrate into a position opposite the printing stencil, acquiring the actual data of position-determining second structures on the side of the second substrate facing away from the printing side by means of the second optical sensing device and aligning the second substrate and the printing stencil with one another based on a comparison of the reference data with the actual data. (Figure 4)