SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL SIDE BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

摘要

Semiconductor Device Package with Die Receiving Through-Hole and Dual Side Build-Up Layers over both Side-surfaces for WLP andMethod of the Same ABSTRACT OF THE INVENTIONThe present invention discloses a structure of package comprising a substrate with at least a die receiving through holes, a conductive connecting through holes structure and a first contact pads on both side of substrate. At least a die is disposed within the die receiving through holes. A first material is formed under the die and second material is formed under the die and filled in the gap between the die and sidewall of the die receiving through hole. Dielectric layers are formed on the both side surface of the die and the substrate. Re-distribution layers (RDL) are formed on the both sides and coupled to the contact pads. A protection bases are formed over the RDLs.Figure 6