首页> 外国专利> STRUCTURE MODEL DESCRIPTION AND USE FOR SCATTEROMETRY-BASED SEMICONDUCTOR MANUFACTURING PROCESS METROLOGY

STRUCTURE MODEL DESCRIPTION AND USE FOR SCATTEROMETRY-BASED SEMICONDUCTOR MANUFACTURING PROCESS METROLOGY

机译:基于比重法的半导体制造过程计量学的结构模型描述与应用

摘要

A method includes accessing a structure model defining a cross-sectional profile of a structure on a sample. The cross-sectional profile is at least partially defined using a set of blocks. Each of the blocks includes a number of vertices. One or more of the vertices are expressed using one or more algebraic relationships between a number of parameters corresponding to the structure. Information is evaluated from the structure model to produce expected metrology data for a scatterometry-based optical metrology. The expected metrology data is suitable for use for determining one or more of the number of parameters corresponding to the structure. Apparatus are also disclosed.
机译:一种方法包括访问定义样品上的结构的横截面轮廓的结构模型。使用一组块至少部分地定义横截面轮廓。每个块包括许多顶点。使用与该结构相对应的多个参数之间的一种或多种代数关系来表达一个或多个顶点。从结构模型评估信息,以产生基于散射测量的光学计量的预期计量数据。预期的度量数据适用于确定与该结构相对应的多个参数中的一个或多个。还公开了设备。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号