首页> 外国专利> Cu-Zn ALLOY STRIP EXCELLENT IN THERMAL SEPARATION RESISTANCE FOR Sn PLATING AND Sn-PLATED STRIP THEREOF

Cu-Zn ALLOY STRIP EXCELLENT IN THERMAL SEPARATION RESISTANCE FOR Sn PLATING AND Sn-PLATED STRIP THEREOF

机译:镀锡和镀锡钢带具有优异的热分离抗性的Cu-Zn合金钢带

摘要

Disclosed is a Cu-Zn alloy strip which is improved in thermal separation resistance for Sn plating. Also disclosed is such a Cu-Zn alloy strip plated with Sn. Specifically disclosed is a Cu-Zn alloy strip consisting of 15-40% by mass of Zn and the balance of Cu and unavoidable impurities, wherein the total concentration of P, As, Sb and Bi is controlled to be 100 ppm by mass or less, the total concentration of Ca and Mg is controlled to be 100 ppm by mass or less, and the concentrations of O and S are respectively controlled to be 30 ppm by mass or less.
机译:本发明公开了一种Cu-Zn合金带,其改善了用于镀Sn的耐热分离性。还公开了镀有Sn的这种Cu-Zn合金带。具体公开了一种由15〜40质量%的Zn以及余量的Cu和不可避免的杂质构成的Cu-Zn合金带,其中P,As,Sb和Bi的总浓度被控制为100质量ppm以下。将Ca和Mg的总浓度控制为100质量ppm以下,并且将O和S的浓度分别控制为30质量ppm以下。

著录项

  • 公开/公告号WO2007139072A1

    专利类型

  • 公开/公告日2007-12-06

    原文格式PDF

  • 申请/专利权人 NIPPON MINING & METALS CO. LTD.;HATANO TAKAAKI;

    申请/专利号WO2007JP60838

  • 发明设计人 HATANO TAKAAKI;

    申请日2007-05-28

  • 分类号C22C9/04;C22F1/08;C25D5/10;C25D5/50;C25D7/00;H01B5/02;C22F1/00;

  • 国家 WO

  • 入库时间 2022-08-21 20:01:47

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