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Cu-Zn ALLOY STRIP WITH EXCELLENT RESISTANCE TO THERMAL PEELING OF Sn PLATING, AND Sn-PLATED STRIP THEREOF

机译:对镀锡层热剥蚀具有优异抵抗力的铜锌合金带及其镀锡带

摘要

PPROBLEM TO BE SOLVED: To provide a Cu-Zn alloy strip having improved resistance to thermal peeling of Sn plating and also to provide an Sn plated strip of the Cu-Zn alloy strip. PSOLUTION: The Cu-Zn alloy strip has a composition consisting of 15 to 40 mass% Zn and the balance Cu with inevitable impurities. The Cu-Zn alloy strip is characterized in that: the sum total of concentrations of P, As, Sb and Bi is controlled to 100 ppm by mass; the sum total of concentrations of Ca and Mg is controlled to 100 ppm by mass; and concentrations of O and S are controlled to 30 ppm by mass, respectively. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:<要解决的问题:提供一种具有改善的对Sn镀层的热剥离的抵抗力的Cu-Zn合金带,并且还提供该Cu-Zn合金带的镀Sn的带。

解决方案:Cu-Zn合金带材的成分为15至40质量%的Zn和余量的Cu和不可避免的杂质。 Cu-Zn合金带材的特征在于:将P,As,Sb和Bi的浓度的合计控制为100质量ppm。 Ca和Mg的总浓度控制为100质量ppm。 O和S的浓度分别控制为30质量ppm。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007314859A

    专利类型

  • 公开/公告日2007-12-06

    原文格式PDF

  • 申请/专利权人 NIKKO KINZOKU KK;

    申请/专利号JP20060148597

  • 发明设计人 HATANO TAKATSUGU;

    申请日2006-05-29

  • 分类号C22C9/04;C25D5/10;C25D5/50;C25D7;C22F1/08;H01B5/02;C22F1;

  • 国家 JP

  • 入库时间 2022-08-21 20:20:04

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