首页> 外国专利> NOVEL ORGANOSILANE POLYMER, HARDMASK COMPOSITION FOR RESIST UNDERLAYER FILM COMPRISING THE ORGANOSILANE POLYMER, AND PROCESS OF PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION

NOVEL ORGANOSILANE POLYMER, HARDMASK COMPOSITION FOR RESIST UNDERLAYER FILM COMPRISING THE ORGANOSILANE POLYMER, AND PROCESS OF PRODUCING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION

机译:新型有机硅烷聚合物,包含有机硅烷聚合物的用于抗蚀剂底层膜的哈姆达克组合物以及使用该哈姆达克组合物生产半导​​体集成电路装置的过程

摘要

A hardmask composition for processing a resist underlayer film is provided. The hardmask composition comprises: (a) an organosilane polymer prepared by reacting polycondensation products of hydrolysates of compounds represented by Formulae 1, 2 and 3: [RO]3Si-Ar (1) (wherein R is methyl or ethyl and Ar is an aromatic ring-containing functional group), [RO]3Si-H (2) (wherein R is methyl or ethyl), and [RO]3 Si-R' (3) (wherein R is methyl or ethyl and R'is substituted or unsubstituted cyclic or acyclic alkyl) with ethyl vinyl ether of Formula 4: CH2 CHOCH2 CH3 (4) in the presence of an acid catalyst; (b) a solvent; and (c) a crosslinking catalyst.
机译:提供一种用于加工抗蚀剂下层膜的硬掩模组合物。所述硬掩模组合物包含:(a)通过使由式1、2和3表示的化合物的水解产物的缩聚产物反应制备的有机硅烷聚合物,[RO] 3 Si-Ar(1)(其中R为甲基或乙基,并且Ar为芳族化合物)。含环的官能团),[RO] 3 Si-H(2)(其中R为甲基或乙基)和[RO] 3 Si-R'(3)(其中R为甲基或乙基且R'被取代或在酸催化剂的存在下用式4的乙基乙烯基醚:CH 2 CHOCH 2 CH 3(4)的未取代的环状或无环的烷基)。 (b)溶剂; (c)交联催化剂。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号