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Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product

机译:电镀工具,电镀方法,电镀装置,电镀产品以及电镀产品的制造方法

摘要

A plating tool for plating an object, includes a rotatable supporting member which includes an opening formed so as to pass through the rotatable supporting member, a line member which is provided so as to cross the opening, and a guide portion which is provided on the rotatable supporting member so as to promote a flow of a plating liquid toward the opening. A space defined by an inner wall face of the opening and the line member is a cell in which the object to be plated is placed.
机译:一种用于镀覆物体的镀覆工具,包括:可旋转支撑构件,其包括形成为穿过可旋转支撑构件的开口;线构件,其被设置为与该开口相交;以及引导部,其设置在支撑构件上。可旋转的支撑构件,以促进电镀液向开口的流动。由开口的内壁面和线构件限定的空间是其中放置待镀覆对象的单元。

著录项

  • 公开/公告号EP1493847A3

    专利类型

  • 公开/公告日2008-10-01

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号EP20040015654

  • 发明设计人 MITSUI YOJI;GODO TADASHI;OKONOGI ITARU;

    申请日2004-07-02

  • 分类号C25D17/16;C25D7;

  • 国家 EP

  • 入库时间 2022-08-21 19:58:59

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