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PLATING METHOD, PLATED PRODUCT PROVIDED WITH PLATED FILM PRODUCED BY THE PLATING METHOD, AND PLATING SOLUTION

机译:镀覆方法,由该镀覆方法生产的镀覆膜提供的镀覆产品和镀覆溶液

摘要

PROBLEM TO BE SOLVED: To provide a plated gold film having a finely shaped body dispersed therein, by uniformly dispersing the finely shaped body in a plating solution such as a gold plating solution to which a surface active agent cannot be applied.;SOLUTION: A plating method employs the plating solution containing the finely shaped body to form a plated film having the finely shaped body dispersed therein, and includes at least: a surface treatment step of forming a carboxyl group on the surface of the finely shaped body; a plating solution preparation step of dispersing the finely shaped body having the carboxyl group formed thereon in the plating solution; and a plating step of forming a plated film having the finely shaped body dispersed therein, by using the plating solution having the finely shaped body dispersed therein.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:通过将精细形状的物体均匀地分散在不能施加表面活性剂的镀金溶液(例如,镀金溶液)中,来提供其中分散有精细形状的物体的镀金膜。镀覆方法使用含有微细成形体的镀液来形成分散有微细成形体的镀膜,并且至少包括:在微细成形体的表面上形成羧基的表面处理步骤;和在该微细成形体的表面形成羧基的表面处理步骤。电镀液制备步骤,将其上形成有羧基的精细成型体分散在电镀液中; ;以及通过使用其中分散有精细形状的体的镀液来形成其中分散有精细形状的体的镀膜的镀覆步骤。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2009179827A

    专利类型

  • 公开/公告日2009-08-13

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORP;

    申请/专利号JP20080017801

  • 发明设计人 DEO SHINICHI;YOSHIDA YUKIHISA;

    申请日2008-01-29

  • 分类号C25D15/02;C25D7;H01H11/04;H01H49;

  • 国家 JP

  • 入库时间 2022-08-21 19:46:14

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