METHOD FOR THE PACKAGING OF OPTICAL OR OPTOELECTRONIC COMPONENTS, AND OPTICAL OR OPTOELECTRONIC PACKAGE ELEMENT PRODUCIBLE ACCORDING TO THE METHOD

摘要

A method for packaging optical or optoelectronic components, and an optical or optoelectronic package element produced using the method are provided to improve the productivity by using prefabricated shaped glass solders. A method for packaging optical or optoelectronic components comprises the steps of allowing a glass solder to make contact with a metal package element and a transparent package element, and heating the glass solder through contact with the metal package element. The glass solder is molten and solidified such that sealed ring-type bonding is formed between the metal package element and the transparent package element. The metal package element is inductively heated by alternating electromagnetic field generated by an induction coil. A shaped glass solder is molten between the metal package element and the transparent package element.