A SOCKET FOR TESTING PACKAGES, A RUBBER FOR THE TEST SOCKET, AND A GUIDE FOR THE TEST SOCKET

摘要

A socket for testing packages, a rubber for the test socket, and a guide for the test socket are provided to obtain test result of a multi chip semiconductor package by using a single chip semiconductor package without fabricating the multi chip semiconductor package. More than two rubbers(230) comprise a chip package connection part connected to a chip package electrically and an external connection stage connected to an external electric line electrically. More than two guides(220) accommodate the chip package, and comprise an electric line including an external connection stage connected to an external electric line electrically. A socket frame(210b) accommodates the rubber and the guide. The number of the rubbers is equal to the number of the guides. The rubbers and the guides are stacked in order for one rubber to be located on the bottom of an accommodation space of the socket frame in turn.