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BACK ILLUMINATED CMOS IMAGE SENSORS WITH DEEP TRENCH ISOLATION AND METHOD FOR PRODUCING THE SAME

机译:具有深沟槽隔离的背照式CMOS图像传感器及其制造方法

摘要

A back illuminated CMOS image sensor having a deep trench device isolating film and a method for producing the same are provided to prevent an electrical crosstalk and an optical crosstalk between pixels by isolating a photo diode of a pixel array using a device isolating film with a deep trench structure. A back illuminated CMOS image sensor comprises a device isolating film with a deep trench structure(13), a photo diode(11), a pixel circuit(20), and a lens(30). The device isolating film with the deep trench structure is formed by extending from a first side to a second side of a semiconductor substrate(10). The photo diode is defined by the device isolating film with the deep trench structure, and is formed by extending from a first side to a second side of the semiconductor substrate. The pixel circuit adjacent to the first side of the semiconductor substrate is formed. The lens adjacent to the second side of the semiconductor substrate is formed.
机译:提供了具有深沟槽器件隔离膜的背照式CMOS图像传感器及其制造方法,以通过使用具有深沟槽的器件隔离膜隔离像素阵列的光电二极管来防止像素之间的电串扰和光学串扰。沟槽结构。背照式CMOS图像传感器包括具有深沟槽结构的器件隔离膜(13),光电二极管(11),像素电路(20)和透镜(30)。通过从半导体衬底(10)的第一侧延伸到第二侧来形成具有深沟槽结构的器件隔离膜。光电二极管由具有深沟槽结构的器件隔离膜限定,并且通过从半导体衬底的第一侧延伸到第二侧而形成。形成与半导体衬底的第一侧相邻的像素电路。形成与半导体衬底的第二侧相邻的透镜。

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