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AG CONTACTS FOR INHIBITION OF ELECTROCHEMICAL MIGRATION AND METHOD FOR MANUFATURING THE SAME

机译:禁止电化学迁移的AG触点及其制造方法

摘要

Ag- alloy contact points, for restricting an electrochemical migration and manufacturing method, palladium monoxide layer is formed by a heat treatment and is arranged to carry out high-efficient and economic migration prevention, a plating palladium layers can be formed on surface in a contact point, after a pulse plating method. A kind of method, for manufacturing an Ag- alloy contact points for restricting an electrochemical migration, comprising the following steps: by a kind of Ag- alloys, form plating palladium layers (2) on a surface of a contact point (1) and manufactured by a pulse plating method; Palladium monoxide layer (3) are formed on the surface of contact point from palladium membranes by executing a hot-working. Plating palladium layers are made of at least 1 micron thickness to obtain an effective thickness of oxidation palladium layers, are used to restrict an electrochemical migration after executing hot-working. Hot-working is executed at 650-700? five minutes C.
机译:Ag-合金接触点,为了限制电化学迁移和制造方法,通过热处理形成一氧化钯层,并且布置该一氧化钯层以进行高效和经济的防止迁移,可以在接触的表面上形成镀钯层。点后,采用脉冲电镀法。一种用于制造用于限制电化学迁移的Ag合金接触点的方法,该方法包括以下步骤:通过一种Ag合金,在接触点(1)的表面上形成镀钯层(2),并且通过脉冲电镀法制造;通过进行热加工,在钯膜的接触点的表面上形成一氧化钯层(3)。电镀钯层的厚度至少为1微米,以获得有效厚度的氧化钯层,用于限制热加工后的电化学迁移。热加工在650-700执行?五分钟C.

著录项

  • 公开/公告号KR20080021400A

    专利类型

  • 公开/公告日2008-03-07

    原文格式PDF

  • 申请/专利权人 HYUNDAI MOTOR COMPANY;

    申请/专利号KR20060084776

  • 发明设计人 NAM YOUNG MIN;

    申请日2006-09-04

  • 分类号H01H1/021;H01H1/0237;H01H1/023;H01H1/02;

  • 国家 KR

  • 入库时间 2022-08-21 19:54:02

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