Design layout structure of a semiconductor chip package for whether the situation of the air pollution detection system using a mobile terminal

摘要

A structure of a design arrangement of a semiconductor chip package for identifying a state of an air pollution detection system using a mobile terminal is provided to minimize a circuit space by forming a vertically stacked structure of semiconductors. A semiconductor chip package for identifying a state of an air pollution detection system using a mobile terminal includes a set of semiconductors for converting a sensing signal of a gas sensor unit for sensing density of harmful gas to digital data, processing the converted digital data according to a stored program in order to calculate the density of the harmful gas, and outputting the calculated data. The set of the semiconductors includes a stacked structure of a first semiconductor chip layer, a second semiconductor chip layer, a third semiconductor chip layer.