POWER MODULE WITH STACKED FLIP-CHIP AND METHOD OF FABRICATING THE SAME POWER MODULE

摘要

A power module having a stacked flip-chip and a fabricating method thereof are provided to reduce remarkably a total size thereof in comparison with a conventional bonding method by mounting chips on an interconnecting substrate or a lead frame in a flip-chip method. A control element part(B) includes a control element chip(150). A power element part(A) includes a power element chip(120) connected electrically with a lead frame(170). The control element part and the power element part are arranged at an upper part and a lower part of an interconnecting substrate(140). The control element chip and the power element chip are coupled with the lead frame or the interconnecting substrate in a flip-chip method. A thermal substrate(110) is formed to radiate the heat of the power element part. The thermal substrate is formed by stacking a copper thin film on a ceramic substrate.