A method for producing polyepoxyimide-nanosilica organic/inorganic hybrid materials by using colloidal silica is provided to obtain organic/inorganic hybrid materials having excellent dielectric characteristics, heat resistance and adhesive property. A method for producing polyepoxyimide-nanosilica organic/inorganic hybrid materials by using colloidal silica comprises the steps of: adding 1-30 parts by weight of a silane as a surface-treating agent to 100 parts by weight of colloidal silica to perform organic modification of the surface of the colloidal silica; adding 1-50 parts by weight of a reactive silane to the product of the preceding step to form an organic reactive group on the colloidal silica, thereby forming a colloidal silica silane sol; and adding 1-50 parts by weight of the colloidal silica silane sol to 100 parts by weight of polyepoxyimide to perform hybridization.
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