Method for preparing low stress polyimide copolymer for packages of microelectronic devices

摘要

PURPOSE: Provided is an insulating polyimide copolymer used as an adhesion material for a package of a fine electronic element, which can control stress properties according to the property of each substrate. CONSTITUTION: The insulating polyimide copolymer is produced by preparing a polyamic acid by using 1,2,4,5-benztetracarboxylic dianhydride(PMDA) of formula 1, bisphenyl tetracarboxyphenyl dianhydride(BPDA) of formula 2, and 1,4-phenylene diamine(PDA) of formula 3 as monomers and then performing a thermal imidation. In the preparation of the polyimide copolymer by the thermal imidation, the property of a thin film is changed according to the condition of the process.