WIRE BONDING SIMULATION DEVICE FOR TRAINING OPERATOR AND METHOD THEREOF, AND COMPUTER-READABLE RECORDING MEDIUM HAVING PROGRAM FOR WIRE BONDING SIMULATION

摘要

A device and a method for simulating wire bonding to train an operator, and a computer-readable recording medium storing a program thereof are provided to realize an efficiently training effect and reduce cost needed for training the operator largely by training the operator to really adjust a wired bonding process performed in a real wire bonder. A vision monitor(18) displays material for the wire bonding through an execution program of a CAD(Computer-Aided Design) program. A bonder setting monitor(20) displays a setup menu for the wire bonding of the displayed material. A setup menu executing program module(30) stores in a storing part of a computer to execute the setup menu. A spreadsheet program module(22) stores various kinds of numerical information for a substrate, a semiconductor chip, a wire, and a packet in a spreadsheet file as the information for executing the setup menu. An input part(10) selects and adjusts the displayed setup menu. A CAD program module(26) draws a wire bonding line between the substrate and the semiconductor chip according to a coordinate value while loading the selected substrate and semiconductor chip from the spreadsheet program module and displaying the loaded substrate and semiconductor chip on a 2D(Dimensional) screen.