SEMICONDUCTOR DEVICE CAPABLE OF TESTING ON DIE TERMINATION CIRCUIT USING A BOUNDARY SCAN CIRCUIT, TEST SYSTEM AND TEST METHOD HAVING THE SAME

摘要

A semiconductor device, a test system and a method of testing an on die termination (ODT) circuit are disclosed. The semiconductor device includes an ODT circuit, a termination impedance control circuit and a boundary scan circuit. The termination impedance control circuit generates termination impedance control signals in response to a test mode command. The ODT circuit is coupled to the plurality of input/output pads and generates a plurality of termination impedances in response to the impedance control signals. The boundary scan circuit stores the termination impedances to output the stored termination impedances. Thus, the semiconductor device may test an ODT circuit accurately by using a smaller number of pins and may reduce a required time for testing the semiconductor device.