首页> 外国专利> METHOD OF GROWING GAN LAYER FOR MANUFACTURING LIGHT EMITTING DIODE HAVING ENHANCED LIGHT EXTRACTION CHARACTERISTICS, METHOD OF MANUFACTURING LIGHT EMITTING DIODE USING THE SAME, AND LIGHT EMITTING DIODE DEVICE THEREOF

METHOD OF GROWING GAN LAYER FOR MANUFACTURING LIGHT EMITTING DIODE HAVING ENHANCED LIGHT EXTRACTION CHARACTERISTICS, METHOD OF MANUFACTURING LIGHT EMITTING DIODE USING THE SAME, AND LIGHT EMITTING DIODE DEVICE THEREOF

机译:具有增强的光提取特性的制造发光二极管的gan层的生长方法,使用相同的发光二极管的制造方法及其发光二极管装置

摘要

A method of growing a GaN layer, a method of manufacturing a light emitting diode using the same and a light emitting diode device manufactured by the same are provided to maximize the number of crystal faces formed on a side of the GaN layer. A GaN thin film(20) is formed on a substrate, and an insulating layer pattern(30) defining a hexagonal opening pattern(40) is formed on the GaN thin film to expose an upper surface of the GaN thin film in a hexagonal shape. The insulating layer pattern is formed in such a manner that a line connecting opposite cusps of a hexagon is laid at an angle of 30 degrees to direction [1000] of GaN. A GaN layer(50) is selectively formed on the hexagonally exposed GaN thin film by using the insulating layer pattern as a mask to have a thickness of 20 to 70 mum, so that a horizontal cross section of the GaN layer has 12 angled shape.
机译:提供一种生长GaN层的方法,一种使用该GaN层的制造发光二极管的方法以及由其制造的发光二极管器件,以使在GaN层的侧面上形成的晶面的数量最大化。在衬底上形成GaN薄膜(20),并且在GaN薄膜上形成限定六角形开口图案(40)的绝缘层图案(30),以六角形形状暴露GaN薄膜的上表面。 。以如下方式形成绝缘层图案:连接六边形的相对尖部的线与GaN的方向[1000]成30度角。通过使用绝缘层图案作为掩模,在六边形暴露的GaN薄膜上选择性地形成GaN层(50),以具有20至70μm的厚度,使得GaN层的水平截面具有12个成角度的形状。

著录项

  • 公开/公告号KR100831835B1

    专利类型

  • 公开/公告日2008-05-28

    原文格式PDF

  • 申请/专利权人 SILTRON INC.;

    申请/专利号KR20060131812

  • 申请日2006-12-21

  • 分类号C30B29/38;

  • 国家 KR

  • 入库时间 2022-08-21 19:52:07

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