首页> 外国专利> Phase change memory device having increased contact area between lower electrode contact layer and phase change layer and method of manufacturing the same

Phase change memory device having increased contact area between lower electrode contact layer and phase change layer and method of manufacturing the same

机译:在下电极接触层和相变层之间具有增加的接触面积的相变存储器件及其制造方法

摘要

The phase change memory device and a manufacturing having a large contact area between the lower electrode contact layer and the phase change layer method is disclosed on. The phase change memory element of the present invention comprises a switching device coupled to the storage node and the lower electrode contact layer comprises a lower electrode contact layer, a phase change layer and the upper electrode layer filled in the via hole where the lower electrode contacts the cheungneun provides a phase change memory device and a manufacturing method which is characterized by having a projection protruding phase-change layer. The projections with a low etching rate etching condition of the lower electrode contact layer may be formed in the interlayer insulating layer at the circumference by dry or wet etching, can be formed by selective growth method, be formed using a deposition and photo etching process may. The selective growth method, a deposition and photo may be further subjected to the dry or wet etching after the etching process.
机译:其上公开了相变存储器件以及在下电极接触层和相变层方法之间具有大接触面积的制造。本发明的相变存储元件包括耦合到存储节点的开关器件,并且下电极接触层包括下电极接触层,相变层和填充在下电极接触的通孔中的上电极层。 Cheungneun提供一种相变存储器件及其制造方法,其特征在于具有凸出突出的相变层。下电极接触层的具有低蚀刻速率蚀刻条件的突起可以通过干法或湿法蚀刻在周围的层间绝缘层中形成,可以通过选择性生长法形成,可以使用沉积和光蚀刻工艺形成。 。在蚀刻工艺之后,可以进一步对选择性生长方法,沉积和照片进行干式或湿式蚀刻。

著录项

  • 公开/公告号KR100858083B1

    专利类型

  • 公开/公告日2008-09-10

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20060101570

  • 发明设计人 김기준;강윤호;서동석;

    申请日2006-10-18

  • 分类号H01L27/115;H01L21/8247;

  • 国家 KR

  • 入库时间 2022-08-21 19:51:37

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