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Probe station and testing method for a wafer using the same

机译:探针台和使用该探针台的晶片测试方法

摘要

A probe station and a testing method for a wafer using the same are provided to improve accuracy of wafer position, and to prevent wafer damage owing to sliding of the wafer. A wafer is disposed on a chuck which has a penetration hole passing through vertically to the upper plane. A plurality of support pins(200) are located at the lower part of the chuck, respectively comprises vacuum holes passing through the top and bottom ends. A vacuum device(300) adheres the wafer to the top end of the plural support pins by configuring the inner side of the plural vacuum hole as a vacuum state.
机译:提供一种探针台和使用该探针台的晶片的测试方法,以提高晶片位置的准确性,并防止由于晶片的滑动而造成的晶片损坏。晶片被放置在卡盘上,该卡盘具有垂直于上平面穿过的通孔。多个支撑销(200)位于卡盘的下部,分别包括穿过顶端和底端的真空孔。真空装置(300)通过将多个真空孔的内侧形成为真空状态,将晶片粘附于多个支撑销的顶端。

著录项

  • 公开/公告号KR100865889B1

    专利类型

  • 公开/公告日2008-10-29

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20060128464

  • 发明设计人 김맹권;진전호;최기욱;최수현;

    申请日2006-12-15

  • 分类号H01L21/66;

  • 国家 KR

  • 入库时间 2022-08-21 19:51:30

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