SPIN HEAD AND METHOD FOR CHUCKING/UNCHUKING SUBSTRATE USING THE SPIN HEAD, AND APPARATUS FOR TREATING SUBSTRATE WITH THE SPIN HEAD

摘要

the present invention is a process when the supporting substrate and spinning the spin head and spin the head of the wafer chuck / unloading chucking method , and that having the spin head and to an apparatus for performing a process for processing a substrate , according to the present invention , the part that contacts the kingpin chucking and unloading the chuck to perform chucking the substrate and the substrate to perform a process while the change to ensure that , chuck kingpin and the treatment liquid on the substrate is to prevent the portion contacting the remaining developer .