COPPER PLATED CIRCUIT LAYER-CARRING COPPER CLAD LAMINATED SHEET AND METHOD OF PRODUCING PRINTED WIRING BOARD USING THE COPPER PLATED CIRCUIT LAYER-CARRING COPPER CLAD LAMINATED SHEET

摘要

A fine pitch circuit a case to a circuit ground fact the ratio of the shape processing on a printed circuit board provided with a, an object of the present invention to provide a method of manufacturing that copper-clad laminate and printed circuit board attached to the copper circuit layer as possible to an excellent shape than the conventional do. ; In the copper circuit layer 6 is a copper-clad laminate is attached the copper circuit layer having a for manufacturing a printed wiring board by semi-additive method, in the case of using the specific nickname solution, the copper circuit layer 6 and extraction agree dissolution speed (Vsp) constituting, agree dissolution rate constituting the outer layer copper foil layer 3, with a ratio Rv value (Vsc) = (Vsc / Vsp) is copper to satisfy the relationship that is at least 1.0, the circuit layer (6 ) and using a copper-clad laminate is attached the copper circuit layer comprising the outer layer copper foil layer 3, it is carried out the production of the printed wiring board.