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A method for selecting binders based on its Adhesion Index to create PAVEMENT TECHNOLOGY CHIPSEALING
A method for selecting binders based on its Adhesion Index to create PAVEMENT TECHNOLOGY CHIPSEALING
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机译:一种基于其粘合指数的粘合剂选择方法,以创建铺装技术芯片
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摘要
1. A method of selecting a binder for the creation of chipsealing paving technologies vklyuchayuschiyobespechenie at least one binder; determining adhesion index of said at least one binder; and selecting a binder for said chipsealing process after determining said technology adhesion index based on said Adhesion Index of said at least one vyazhuschego.2. A method according to claim 1, wherein said selected binder has an Adhesion Index of no more than about 3.75, when calculating by multiplying by 100 the decimal logarithm of the viscosity (centipoises) of said binder at the highest temperature that said binder reaches after contact with the aggregate, multiplied by the inverse penetration value (dmm) of said binder at 25 ° C.3. A method according to claim 1, wherein said selected binder has an Adhesion Index of no more than about 3.5, when calculating by multiplying by 100 the decimal logarithm of the viscosity (centipoises) of said binder at the highest temperature that said binder reaches after contact with the aggregate, multiplied by the inverse penetration value (dmm) of said binder at 25 ° C.4. A method according to claim 2, further vklyuchayuschiyvypolnenie Sweep-test to confirm the adhesion of at least one of said binder before selecting said binder for performing said process chipsealing.5 technology. A method according to claim 2, further vklyuchayuschiyukladku said selected binder to a surface; stacking aggregate to said surface after application of said binder for Form
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