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A method for selecting binders based on its Adhesion Index to create PAVEMENT TECHNOLOGY CHIPSEALING

机译:一种基于其粘合指数的粘合剂选择方法,以创建铺装技术芯片

摘要

1. A method of selecting a binder for the creation of chipsealing paving technologies vklyuchayuschiyobespechenie at least one binder; determining adhesion index of said at least one binder; and selecting a binder for said chipsealing process after determining said technology adhesion index based on said Adhesion Index of said at least one vyazhuschego.2. A method according to claim 1, wherein said selected binder has an Adhesion Index of no more than about 3.75, when calculating by multiplying by 100 the decimal logarithm of the viscosity (centipoises) of said binder at the highest temperature that said binder reaches after contact with the aggregate, multiplied by the inverse penetration value (dmm) of said binder at 25 ° C.3. A method according to claim 1, wherein said selected binder has an Adhesion Index of no more than about 3.5, when calculating by multiplying by 100 the decimal logarithm of the viscosity (centipoises) of said binder at the highest temperature that said binder reaches after contact with the aggregate, multiplied by the inverse penetration value (dmm) of said binder at 25 ° C.4. A method according to claim 2, further vklyuchayuschiyvypolnenie Sweep-test to confirm the adhesion of at least one of said binder before selecting said binder for performing said process chipsealing.5 technology. A method according to claim 2, further vklyuchayuschiyukladku said selected binder to a surface; stacking aggregate to said surface after application of said binder for Form
机译:1.一种选择粘结剂的方法,该粘结剂用于产生切屑密封的摊铺技术,其中至少一种粘结剂;确定所述至少一种粘合剂的粘合指数;在基于所述至少一种yaschechego.2的所述粘合指数确定了所述技术粘合指数之后,选择用于所述切屑密封工艺的粘合剂。 2.根据权利要求1的方法,其中当通过将所述粘合剂在接触后达到的最高温度下的所述粘合剂的粘度(厘泊)的十进制对数乘以100来计算时,所述选择的粘合剂具有不大于约3.75的粘合指数。用骨料乘以所述粘合剂在25℃下的反向渗透值(dmm)3。 2.根据权利要求1的方法,其中当通过将所述粘合剂在接触后达到的最高温度下的所述粘合剂的粘度(厘泊)的十进制对数乘以100来计算时,所述选择的粘合剂具有不大于约3.5的粘合指数。用骨料乘以所述粘合剂在25°C下的反向渗透值(dmm)4。 3.根据权利要求2所述的方法,进一步进行vklyuchayuschiyvypolnenie扫描测试,以在选择用于执行所述工艺芯片密封的技术的所述粘合剂之前,确认至少一种所述粘合剂的粘附性。 3.根据权利要求2的方法,进一步将所述选择的粘合剂vklyuchayuschiyukladku粘附到表面上;在使用上述形式的粘合剂后,将骨料堆积在表面上

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